- 您现在的位置：买卖IC网 > Sheet目录369 > W971GG6JB25I (Winbond Electronics)IC DDR2 SDRAM 1GBIT 84WBGA
W971GG6JB
10.12 AC Input Test Conditions
CONDITION
Input reference voltage
Input signal maximum peak to peak swing
Input signal minimum slew rate
SYMBOL
V REF
V SWING(MAX)
SLEW
VALUE
0.5 x V DDQ
1.0
1.0
UNIT
V
V
V/nS
NOTES
1
1
2, 3
Notes:
1. Input waveform timing is referenced to the input signal crossing through the VIH/IL(ac) level applied to the device under test.
2. The input signal minimum slew rate is to be maintained over the range from VREF to VIH(ac) min for rising edges and the
range from VREF to VIL(ac) max for falling edges as shown in the below figure.
3. AC timings are referenced with input waveforms switching from VIL(ac) to VIH(ac) on the positive transitions and VIH(ac) to
VIL(ac) on the negative transitions.
10.13 Differential Input/Output AC Logic Levels
PARAMETER
AC differential input voltage
AC differential cross point input voltage
AC differential cross point output voltage
SYM.
V ID (ac)
V IX (ac)
V OX (ac)
MIN.
0.5
0.5 x VDDQ - 0.175
0.5 x VDDQ - 0.125
MAX.
VDDQ + 0.6
0.5 x VDDQ + 0.175
0.5 x VDDQ + 0.125
UNIT
V
V
V
NOTES
1
2
3
Notes:
1. VID (ac) specifies the input differential voltage |VTR -VCP | required for switching, where VTR is the true input signal (such
as CLK, LDQS or UDQS) and VCP is the complementary input signal (such as CLK , LDQS or UDQS ). The minimum
value is equal to VIH (ac) - VIL (ac).
2. The typical value of VIX (ac) is expected to be about 0.5 x VDDQ of the transmitting device and VIX (ac) is expected to track
variations in VDDQ. VIX (ac) indicates the voltage at which differential input signals must cross.
3. The typical value of VOX (ac) is expected to be about 0.5 x VDDQ of the transmitting device and VOX (ac) is expected to
track variations in VDDQ. VOX (ac) indicates the voltage at which differential output signals must cross.
V DDQ
V IH(ac) min
V IH(dc) min
V SWING(MAX)
V REF
V IL(dc) max
V TR
V DDQ
V IL(ac) max
V SS
V CP
V ID
Crossing point
V IX or V OX
Δ TF
Δ TR
V SSQ
Falling Slew =
V REF - V IL(ac) max
Δ TF
Rising Slew =
V IH(ac) min - V REF
Δ TR
Figure 28 – AC input test signal and Differential signal levels waveform
Publication Release Date: Sep. 24, 2013
- 66 -
Revision A09
发布紧急采购，3分钟左右您将得到回复。
相关PDF资料
W971GG8JB-25
IC DDR2 SDRAM 1GBIT 60WBGA
W9725G6IB-25
IC DDR2-800 SDRAM 256MB 84-WBGA
W9725G6JB25I
IC DDR2 SDRAM 256MBIT 84WBGA
W9725G6KB-25I
IC DDR2 SDRAM 256MBIT 84WBGA
W972GG6JB-3I
IC DDR2 SDRAM 2GBITS 84WBGA
W9751G6IB-25
IC DDR2-800 SDRAM 512MB 84-WBGA
W9751G6KB-25
IC DDR2 SDRAM 512MBIT 84WBGA
W9812G6JH-6I
IC SDRAM 128MBIT 54TSOPII
相关代理商/技术参数
W971GG6JB-25I
制造商:Winbond Electronics 功能描述:-40~85 1GB DDR2 FOR INDUSTRY
W971GG6JB25ITR
制造商:Winbond Electronics Corp 功能描述:1G, DDR2-800, X16, IND TEMP
W971GG6JB25TR
制造商:Winbond Electronics Corp 功能描述:NR, DDR2-800, X16
W971GG6JB-3
制造商:Winbond Electronics Corp 功能描述:1GBIT DDRII
W971GG6KB-18
制造商:Winbond Electronics Corp 功能描述:1G, DDR2-1066, X16 制造商:Winbond Electronics Corp 功能描述:IC MEMORY
W971GG8JB
制造商:WINBOND 制造商全称:Winbond 功能描述:16M × 8 BANKS × 8 BIT DDR2 SDRAM
W971GG8JB-25
功能描述:IC DDR2 SDRAM 1GBIT 60WBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:72 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 存储容量:4.5M（256K x 18） 速度:133MHz 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:0°C ~ 70°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP（14x20） 包装:托盘
W9725G6IB-25
功能描述:IC DDR2-800 SDRAM 256MB 84-WBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:4K (512 x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.173"，4.40mm 宽） 供应商设备封装:8-MFP 包装:带卷 (TR)